Not offhand, no. I was more focused on making sure the ideas had been considered, which – IRT the basic idea of using Mill-based CPUs for avionics – they clearly have been.
Thank you, you have for the most part answered by questions – that these ideas are feasible (or at least potentially so), but would require significant funding for development, and said development would fall outside the overall development of the Mill CPU itself.
Just to make sure I understand correctly:
1) Implementing a radiation-hardened version of Mill (using silicon-over-sapphire or some similar approach) would be up to the IC fabricators, whether it is Mill Computing or someone licensing the design.
2) Implementing Mill cores on an SoC, and what other components would be included on the die, would similarly be the choice of fabricators.
3) The inclusion of other components in the IC package – the details of the exterior pin-outs, and so forth – would be up to the producers of the IC package, who may or may not be the same as the IC fabricators, who in turn may or may not be Mill Computing themselves.
4) Advanced package features such as pin-lead surge cut-offs, in-package power backup, and in-package thermoelectric cooling may or may not be feasible, but the development of them would be in the hands of the designers of the package, rather than directly related to the Mill project.
I am still curious about the feasibility of those last three items, but I don’t know where I would ask about them, nor do I have any clear idea of what developing them would cost – probably quite a large amount. I would be interested in hearing any speculation about them, but I don’t know if this would be the place to have that discussion or not (I am welcome to suggestions about it).
Again, thanks.
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This reply was modified 7 years, 4 months ago by
Schol-R-LEA.
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